Cu-OF 99,95% Powder for Additive Manufacturing
MET Cu-OF is pure, oxygen free Copper with minimum 99,95% Cu. It combines the advantages of Cu-ETP (= CW004A / 2.0065) and phosphor deoxidized Copper materials. The high pureness of the material combined with missing oxygen inclusions allows excellent electrical conductivity and is not affected form hydrogen embrittlement. Therefore, MET Cu-OF has a good deformability, combined with superior solder- and weldability than offered by Cu-ETP. Typical applications are electrical and electronic components for example in the communication industry.
Description
Chemical composition
| Element | Min [wt%] | Max [wt%] |
|---|---|---|
| Pb | – | 0,005 |
| O | – | 0,05* |
| Bi | – | 0,005 |
| Cu | 99,95 | Balance |
Particle Size Distribution (others on request)
| PSD range [µm] | d10min | d90max |
|---|---|---|
| 5 – 20 | 4 | 22 |
| 15 – 45 | 10 | 48 |
| 15 – 53 | 10 | 56 |
| 20 – 63 | 18 | 66 |
| 45 – 106 | 40 | 106 |
Physical properties (Exemplary for specific PSD)
| Properties for PSD 15-45 µm | Min | Max |
|---|---|---|
| Flow rate [s/50g] | – | 20 |
| Bulk density [g/cm³] | 4,5 | – |
Datasheet
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