Cu-OF 99,95% Powder for Additive Manufacturing

MET Cu-OF is pure, oxygen free Copper with minimum 99,95% Cu. It combines the advantages of Cu-ETP (= CW004A / 2.0065) and phosphor deoxidized Copper materials. The high pureness of the material combined with missing oxygen inclusions allows excellent electrical conductivity and is not affected form hydrogen embrittlement. Therefore, MET Cu-OF has a good deformability, combined with superior solder- and weldability than offered by Cu-ETP. Typical applications are electrical and electronic components for example in the communication industry.

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SKU: MET Cu-OF Category: Tags: , , Brand:

Description

Chemical composition

ElementMin [wt%]Max [wt%]
Pb0,005
O0,05*
Bi0,005
Cu99,95Balance

Particle Size Distribution (others on request)

PSD range [µm]d10mind90max
5 – 20422
15 – 451048
15 – 531056
20 – 631866
45 – 10640106

Physical properties (Exemplary for specific PSD)

Properties for PSD 15-45 µmMinMax
Flow rate [s/50g]20
Bulk density [g/cm³]4,5

Datasheet

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