CuNi2SiCr Powder for Additive Manufacturing
MET CuNi2SiCr is a thermally curable low-alloyed copper material with high stiffness, also at elevated temperatures. It offers good thermal and electrical conductivity combined with high corrosion resistance and is well suited for wear and sliding applications. The beryllium free copper alloy is used for tooling, as mold insert and for highly thermally stressed construction elements.
Description
Chemical composition
| Element | Min [wt%] | Max [wt%] |
|---|---|---|
| Ni | 2,0 | 3,0 |
| Si | 0,5 | 0,8 |
| Cr | 0,2 | 0,5 |
| Fe | – | 0,15 |
| Mn | – | 0,1 |
| Pb | – | 0,02 |
| Others total | – | 0,1 |
| Cu | Balance | Balance |
Particle Size Distribution (others on request)
| PSD range [µm] | d10min | d90max |
|---|---|---|
| 5 – 20 | 4 | 22 |
| 15 – 45 | 10 | 48 |
| 20 – 63 | 18 | 66 |
| 45 – 106 | 40 | 106 |
Physical properties (Exemplary for specific PSD)
| Properties for PSD 20-63 µm | Min | Max |
|---|---|---|
| Flow rate [s/50g] | – | 15 |
| Bulk density [g/cm³] | 4,9 | – |
Datasheet
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